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LayerBank 宣布 Mint Blockchain 已加入其种子轮融资并与其达成战略合作
TechFlame
2024-07-23 15:48
TechFlame
2024-07-23 15:48
TechFlame 消息,借贷协议 LayerBank 在 X 平台宣布,以太坊原生 L2 网络 Mint Blockchain 已加入其种子轮融资并与其建立战略合作伙伴关系,双方将共同探索和构建 Mint Blockchain 生态系统和增强 LayerBank 的产品。 据悉, LayerBank 是一个基于 Linea 与 Scroll 构建的非托管借贷平台,为用户提供收益分配和收益共享服务。
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