Payment service provider Due closes $7.3 million seed round led by Speedinvest
TechFlame
2025-07-31 02:47
TechFlame2025-07-31 02:47
English
TechFlame reports that payment service provider Due completed a $7.3 million seed round, led by Speedinvest, with Semantic Ventures, Fabric Ventures, Strobe Ventures, and Polymorphic Capital participating.
Due is integrating local payment channels, liquidity markets, and blockchain networks into a unified infrastructure.